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Power chips are linked to outside circuits via product packaging, and their performance depends upon the assistance of the packaging. In high-power scenarios, power chips are typically packaged as power modules. Chip affiliation refers to the electric link on the top surface area of the chip, which is normally aluminum bonding cord in traditional modules. ^
Conventional power component package cross-section

Currently, business silicon carbide power modules still mainly use the product packaging modern technology of this wire-bonded standard silicon IGBT module. They encounter issues such as large high-frequency parasitic parameters, inadequate heat dissipation capability, low-temperature resistance, and insufficient insulation stamina, which limit using silicon carbide semiconductors. The display screen of superb performance. In order to resolve these issues and completely make use of the big possible advantages of silicon carbide chips, numerous brand-new packaging technologies and remedies for silicon carbide power components have actually arised recently.

Silicon carbide power component bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually created from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold cords to copper wires, and the driving pressure is cost decrease; high-power devices have actually developed from light weight aluminum cords (strips) to Cu Clips, and the driving force is to boost product efficiency. The higher the power, the higher the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared with typical bonding packaging approaches, Cu Clip modern technology has the adhering to benefits:

1. The link in between the chip and the pins is made of copper sheets, which, to a certain extent, replaces the standard cord bonding technique between the chip and the pins. For that reason, an one-of-a-kind plan resistance worth, higher current flow, and far better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can fully save the expense of silver plating and bad silver plating.

3. The item appearance is entirely consistent with normal products and is primarily used in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power materials, and various other fields.

Cu Clip has two bonding approaches.

All copper sheet bonding technique

Both eviction pad and the Source pad are clip-based. This bonding method is a lot more pricey and intricate, yet it can achieve far better Rdson and far better thermal effects.

( copper strip)

Copper sheet plus cable bonding approach

The resource pad makes use of a Clip method, and the Gate uses a Cord technique. This bonding approach is somewhat less expensive than the all-copper bonding technique, conserving wafer location (appropriate to extremely little gate areas). The procedure is easier than the all-copper bonding technique and can acquire better Rdson and far better thermal result.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding green coating on copper, please feel free to contact us and send an inquiry.

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